Feature Exhibitors at ADAS Sensors 2017
OSRAM Opto Semiconductors is one of the key players in the global optoelectronic semiconductor market. It maintains a broad portfolio of products used in lighting and sensing applications. The technologies showcased at this event for ADAS and autonomous vehicles will highlight advances in solid state scanning LIDAR, driver monitoring, night vision and iris recognition applications. A solid state 4 channel laser MEMS scanning LIDAR and an infrared camera with high efficiency at 940nm using pulsed IREDS from OSRAM are planned to be shown.
SiTime Corporation, the leader in MEMS-based timing solutions, offers AEC-Q100 oscillators that are 30 times better in performance and robustness compared to legacy quartz technology. SiTime automotive products are designed for ASIL-compliant applications such as ADAS and offer a unique combination of the widest frequency range and tightest stability at ±20 ppm. By leveraging our revolutionary silicon MEMS, advanced analog technology and semiconductor packaging, SiTime provides unique timing solutions that deliver the highest reliability and robustness, smallest size and best dynamic performance under extreme temperatures, shock and vibration. With 90% market share and over 600 million devices shipped, SiTime is driving the electronics industry to use 100% silicon-based timing.
SpiralGen is a Carnegie Mellon University spin-off that has commercialized technology created over 15 years with $40M in grants from DARPA, NSF and others. “Spiral” is used to solve the most difficult problem that signal process engineers face, platform tuned system optimization. Our Design Space Exploration tool is like having a team of experts at your disposal to quickly explore performance tradeoffs for your specific ADAS criteria. Spiral uses machine learning, compiler technologies and hardware knowledge to find the best solution for your signal processing algorithms and system requirements. Spiral’s rapid iterative approach allows you to test your algorithm quickly on multiple processors to find the best solution for 100X faster design tradeoffs. Spiral uses cross kernel optimization to autonomously generate high assurance and high performance code for 10X faster code. Spiral harnessed the complexity and solves requirements simultaneously for power, memory, latency, size, throughput speed/frame rate, and accuracy/resolution.
STATS ChipPAC provides innovative and cost effective semiconductor design, packaging and test solutions for a wide range of market segments including the MEMS and sensors market. Our broad technology portfolio and dedicated MEMS team can address your manufacturing challenges and support your production ramp by co-designing the package, providing a quick path to bill of material (BOM) qualification, special quality baseline and handling guidelines, and providing in-house test solutions. We offer leadframe and laminate packages (overmolded, cavity mold or lidded) as well as advanced fan-in (WLCSP) and fan-out wafer level technology (2D and 3D eWLB), flip chip interconnect, and system-in-package (SiP). STATS ChipPAC delivers smaller form factor, higher performance and lower cost solutions for our customers’ end products. Find out how our innovative integration solutions can help your business achieve the size, performance and cost requirements for your MEMS and sensor applications.
T-Micro is the unique and advanced 3D-IC process and MEMS process-oriented company. We have an 8/12-inch R&D fab for the research and development of new 2.5D/3D integration technologies and creative applications. We offer a broad range of services to our customers to meet the mounting R&D needs of the semiconductor industry and related industries. We collaborate with chipmakers, equipment and materials suppliers, universities, and companies working in emerging technologies, to test new designs, integration methodologies, and prototype systems in a manufacturing environment, leveraging the experience, facilities and tools already in place in the fab. We provide a cost-competitive process development infrastructure in a manufacturing-like fab environment and a low-cost, short TAT prototyping of proof of concepts using commercial/customized 2D chips, and a base-line process set-up for the pilot production of creative 3D systems.